es gibt mehr Details (von meinem Reseller):
Industriespezifische Flow Simulation Erweiterungen:
1. HVAC/HKLS: Heizung, Klima, Lüftung, Sanitär
2. Elektronik & Kühlung
Zu 1: HVAC Design
Zielkunden: Unternehmen, die Klima- und Lüftungs- Anlagen auslegen
Technische Herausforderungen:
· Optimierung der Luftströmung
· Thermische Auslegung der Produkte
· CFM Anforderungen (1cfm = 0,47l/sec)
· Sicherstellung des menschlichen Wohlbefindens
Im Detail:
· Advanced Radiation Modeling:Semi-transparent solids (Radiation absorption in solids)
- Wavelength dependency
- Spectrum definition
- Specularity of surfaces
- Refractive index
- Radiation source feature
· Comfort Parameters (mare statistical analysis of flow in environment to meet needs)
- Predicted Mean Vote (PMV)
- Predicted Percent Dissatisfied (PPD)
- Operative Temperature
- Draft Temperature
- Air Diffusion Performance Index (ADPI)
- Contaminant Removal Effectiveness (CRE)
- Local Air Quality Index (LAQI)
- Flow Angle
· Library Database Expansion
- Additional database of Solids
- Includes full material properties for Alloys, Ceramics, Glasses & Minerals, Laminates, Metals, Polymers and Semiconductors
- More supplier fan curves
Zu 2: Elektronik & Kühlung
Zielkunden: Unternehmen, die Leiterplatten in Ihren Produkten verwenden
Technische Herausforderungen:
· Optimierung der Luftströmung
· Thermische Auslegung der Produkte
· Kühlkörper- Auswahl und - Design
· Optimale thermische Leiterplattenauslegung
· Lüfter-Selektion
Im Detail:
· Two Resistor Component Contact Model
- A two resistor compact model of mono-chip electronic packages is now available.
- This is the simplest possible network compact model, and consists of a defined junction-to-case resistance (Rjc) and a junction-to-board (Rjb) resistance.
- This data is applied to the defined package geometry consisting of two flat solid bodies representing the junction and case.
- Benefits:
- Their structure is intuitive to the user
- They are test-based on an approved JEDEC standard.
- They are likely to give acceptable accuracy for design parametrics.
- They represent a significant increase in accuracy for prediction of absolute results as compared to the traditional single-resistor metrics.
- Fully supported, with an in-built library of two-resistor models of standard JEDEC package outlines.
· Joule Heating
- The software is now able to calculate steady-state direct electric current in electro-conductive solids.
- The corresponding specific Joule heating effect is automatically calculated and included in heat transfer calculations.
- The electrical resistivity of the material may be isotropic, anisotropic or temperature dependent.
- The calculations of electric potential and current are performed only in conductive solids, i.e. metals and metal-containing composite materials.
- Dielectric solids, semiconductors, fluid and void areas do not participate in the calculation.
- Benefits:
- Provides a solution for many applications in automotive and power electronics, where Joule heating effects are a crucial physical process (e.g. electronic motor control units or power distribution racks).
- Allows accurate modelling of the physics in applications where heating is an unwanted by-product of current use (e.g. load losses in electrical transformers).
- Provides a solution for a common request to be able to model the joule heating effect of PCB traces
· Heat Pipe Compact model
- Flow Simulation now has a compact representation for the heat pipe requiring the user to specify the overall effective thermal resistance of the heat pipe, based on its performance for the system being designed, along with selection of a part and two faces to define the heat flux direction.
- The performance of a heat pipe depends on many factors, such as inclination, orientation, length, etc. - The user can simulate different conditions by specifying different Effective Thermal Resistances for the part.
- Benefits:
- A simple and pragmatic method for modelling a predominant cooling approach in laptops and other space constrained or conduction cooled designs.
- Avoids the need to model the complex two-phase physics within these devices.
· PCB Generator
- This feature allows you to obtain the bi-axial thermal conductivity values, with the normal (through plane) and in-plane thermal conductivities automatically derived from the PCB structure and the properties of the specified conductor and dielectric materials.
- The board can also be arbitrarily oriented with respect to the global coordinate system,
- i.e. angled PCB’s can be modelled.
- Benefits:
- Simple and standard approach for determining the physical properties of multi-layer PCB’s.
- The arbitrary orientation enables compact and accurate modelling of devices such as angled DIMM’s.
· Library Update
- A broad range of new Solids, Fans, Thermoelectric Coolers, and Two-Resistor Components has been added to the Engineering Database.
- A library of interface materials has been added.
- A library of solids representing typical IC Packages has been added providing the possibility to simulate an IC Package as a one-piece solid with effective density, specific heat and thermal conductivity.
- Benefits
- User has immediate access to pre-defined and validated attributes associated with the electronics parts he is working with in design.
- They are presented to the user in a manufacturer centric way, that makes selection of the appropriate data fast and easy.
- The libraries can be further extended by the user with their own attribute datasets or if they wish to add another supplier dataset not currently available.
[Diese Nachricht wurde von HPVD am 04. Nov. 2010 editiert.]
[Diese Nachricht wurde von HPVD am 04. Nov. 2010 editiert.]
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